In recent years, power management ICs have continuously penetrated into efficient and streamlined application fields, driving power supply chips to develop towards higher current, smaller size, higher efficiency, and stricter voltage feedback accuracy. On one hand, traditional power supply chips require a large number of peripheral components. On the other hand, to optimize the electrical and thermal performance of the chips to the greatest extent, users often need to accomplish this through complex routing and layout. Minimal peripherals, high efficiency, and high performance are the inevitable trends in the development of power modules.

In the future, POL module packaging is shifting towards micro load point (μPOL^TM) development. This packaging method greatly optimizes POL performance. μPOL^TM adopts an advanced panel-level packaging form, integrating power supply chips, inductors, capacitors, and other components into the substrate to form an ultra-highly integrated power supply chip module. Under the demands for high space utilization and strong power supply capability in electronic products, the inductors and numerous peripheral parameter adjustment components placed around traditional switching power supply chips undoubtedly pose a major obstacle to compressing PCB space. In applications, to ensure the chip functions properly, a significant amount of PCB area must be sacrificed, which is not conducive to the miniaturization development of electronic devices. Modular packaging, thanks to its small size, high integration, and minimal peripheral application circuitry, can reduce the PCB area occupied by power supply chips, effectively improve users' PCB utilization, and meet the increasing demand for miniaturization in electronic devices. Simultaneously, the chip is directly embedded into the substrate, greatly increasing the overall module's heat dissipation area. Even under full-load operating conditions, the temperature does not become excessively high.

In traditional power supply chips, heat generated by the chip and inductor causes the inter-board temperature to rise, subsequently reducing the chip's working efficiency. Benefiting from the excellent heat dissipation performance of μPOL^TM, the module's efficiency and thermal performance have been significantly improved.

Addressing this power supply demand, IVS has launched the ISM6636x (x represents part number A/B/C), a 6A DC step-down power module using μPOL^TM design, currently the smallest in the industry. The highly compact point-of-load module adopts a miniature package measuring 3.3mm × 3.3mm × 1.45mm. It supports an input of 4.5V~16V, an output of 0.6V~5V, with a peak current up to 8A and a continuous operating current up to 6A. In addition to the POL chip, the ISM6636A/B/C integrates the output inductor, bootstrap capacitor, and VCC bypass capacitor within the module, significantly reducing the motherboard space occupied by the module in practical applications. Furthermore, the ISM6636x supports I2C communication to configure the module's internal settings, further simplifying its application. Figure 1 illustrates the outstanding advantage of the ISM6636x in simplifying peripheral components. The ISM6636x integrates a DC step-down chip capable of carrying 6A on a 3cm × 3cm substrate, with the bootstrap capacitor, VCC bypass capacitor, and power inductor arranged on top of the substrate. Only input/output and VCC bypass capacitors are needed peripherally for normal operation, reducing design difficulty for users while saving PCB space resources.

Figure 1A. ISM6636x 3D view Figure 1B. ISM6636x Minimal Peripheral Pinout Diagram Figure 1C. Vertical Structure vs. Module Comparison

Regarding efficiency and thermal performance, the ISM6636x adopts a substrate packaging method, which is beneficial for heat dissipation. The integrated design of magnetic components and capacitors ensures fixed, excellent routing layouts between the substrate and components, allowing the chip's electrical performance and efficiency to reach an optimal state. Figures 2 and 3 show the relationship between efficiency, temperature, and current for the ISM6636x using μPOL^TM packaging under different output voltages and without additional heat dissipation measures. This verifies that the excellent thermal performance of the ISM6636x results in outstanding operating temperature and efficiency.

Figure 2. ISM6636x Efficiency vs. Current Graph Figure 3. ISM6636x Operating Temperature vs. Current Graph

The ISM6636x uses a vertical structure to reduce the practical application volume while optimizing thermal performance and maintaining good reliability. It has passed multiple reliability tests according to JEDEC standards, including temperature cycling test, pressure cooker test, high-temperature storage test, aging life test, highly accelerated temperature and humidity stress test (HAST), etc. Additionally, the ISM6636x features ESD protection greater than 2kV to safeguard subsequent production and manufacturing.

As the industry's smallest 6A DC step-down power module, the ISM6636x combines a miniature package and minimal peripherals with advantages including smaller application area, more comprehensive programmable features, excellent electrical characteristics, and dynamic performance. Whether for servers and communication equipment pursuing performance and stability, or data centers focusing on loss and size, the ISM6636x provides a perfect solution. As a domestic power supply chip enterprise, IVS has once again demonstrated the "China Chip" to the world, contributing to the field of low-voltage, high-current power modules in China!

【About IVS】

Dongguan InnoVision Semiconductor Co., Ltd. (IVS) was established in May 2016, located in Dongguan Songshan Lake. With a professional technical team, IVS adheres to independent forward design and is dedicated to low-voltage, high-current power supply chip design. The product range includes switching power supplies, multi-phase controllers, smart power stages, power modules, etc. Addressing the domestic gap in CPU power supply, IVS offers a complete solution, breaking the monopoly of foreign chips. The products can be widely applied in markets such as servers, computers, communications, and consumer electronics.

Contact email: sales@innovisionsemi.com