From July 1st to 3rd, the 2026 Munich Shanghai Electronics Show was held as scheduled at the Shanghai New International Expo Centre.

As a domestic core power chip manufacturer deeply rooted in the high-power low-voltage high-current segment, IVS brought its full range of DC/DC power chips to the exhibition. The product portfolio comprehensively covers diverse application scenarios such as AI terminal devices, accelerator cards, and data center computing infrastructure, providing targeted solutions to various power supply challenges in the AI industry.

Major Launch: Directly Addressing AI Computing Power Core Supply

As the total power consumption of data centers and AI accelerator cards continues to rise, with per-cabinet power moving toward the kilowatt level, stringent requirements are imposed on the transient response and conversion efficiency of the power supply system. Multi-phase power architecture has become the preferred choice for high-end computing platforms. Coordinated optimization of the control architecture and power stage is key to breaking through the performance bottleneck of high-load power supply.

IS6209A+IS6821A – New 16-Phase Step-Down VR Solution

IS6209A

• Flexible phase configuration: Independent dual-loop control (Loop1≤16 phases, Loop2≤8 phases)
• Supports PMBus/SVI3 protocols, per-phase switching frequency from 200kHz to 3MHz
• Fast transient response, effectively suppresses ripple fluctuation
• Proprietary efficiency tuning technology, dynamic phase control, and intelligent power state switching
• Synchronized optimization of dual-loop transient performance, effectively reduces output capacitors and system cost
• Multiple protection and fault detection mechanisms: OVP/UVP/UCP/OCP/OTP/UVLO/CAT_FLT

IS6821A

• 90A, smart power stage with integrated power MOSFET and gate driver
• IMON accuracy deviation ≤ ±2% after high-temperature burn-in testing
• IMON fault reporting function, supports phase-loss protection
• Operating frequency range covering 100kHz to 2MHz
• Single chip withstands positive current 240A-1ms load without burnout, negative current 130A without burnout
• Accurate current/temperature sampling, monitoring, and alarm functions
• Built-in positive and negative current limit functions with fault reporting

IS6212A/B+IS6829B – 3-Rail/4-Rail Step-Down VR Solution

• IS6212A: 4-rail, 9-phase PWM controller, N+M+0+P≤9 (M≤4, 0≤3, P≤2)
• IS6212B: 3-rail, 8-phase PWM controller, M+N+0≤8 (M≤4, 0≤3)
• Compatible with PMBus/I2C protocol specifications, optional SVI3 high-speed communication bus
• IS6829B: 60A, smart power stage with integrated power MOSFET and gate driver
• Compact package with optimized internal heat dissipation path, excellent thermal performance under high load
• Comprehensive optimization of control accuracy, dynamic response, and conversion efficiency

Iterative Upgrades Covering Medium and Low Power Terminal Scenarios

IS6611A – 20A Fully Integrated High-Frequency Power Solution

• Compatible with PMBus^TM protocol
• Equipped with non-linear control, supports external bias
• Multiple selectable switching frequencies, configurable via pins or NVM
• Ultra-small 3mm×3mm package and advanced process technology
• Built-in black box function, peak efficiency improved by 3% compared to previous generation

IS6615A – 40A Fully Integrated Synchronous Step-Down Converter

• Compatible with PMBus^TM protocol
• Excellent dynamic regulation
• Achieves high efficiency across the output load range
• Superior load and line regulation, voltage accuracy ±0.5%
• Comprehensive fully integrated protection features

ISM6402B – 15A Fully Integrated Power Module

• Wide input voltage range (2.7V-16V)
• Internally integrated DC-DC converter, MOSFET, inductor, capacitor, and external resistors
• Supports 15A continuous output, 20A peak output current
• Output voltage accuracy up to ±1% over full temperature range
• Integrated hiccup-mode short-circuit protection, OVP, and full protection set

IS6108B – 50A E-Fuse with Paralleling Capability

• Programmable hot-swap protection IC with built-in 0.8mΩ MOSFET
• Maximum output current up to 60A
• Supports multiple chips in parallel for higher current
• Supports fault indication (GOK) and fault type (FLT_TYPE) signals
• Active current sharing between chips during soft-start in parallel applications

On the second day of the exhibition, industry experts and partners continued to visit the IVS booth for discussions. The company's technical staff and visiting guests exchanged ideas on product performance, technology trends, and other topics.

The exhibition is still ongoing. We will continue to welcome industry colleagues to our booth at the Shanghai New International Expo Centre to discuss innovative localized solutions for AI computing power supply.